Vacuum plasma equipment features: high precision, fast responses, and compatibility good control, support the improvement of function and professional technology
• processing uniformity
• ion energy low, does not damage the substrate
• no electrode and substrate contamination
• patent design special plasma electrode
• high density plasma source
§ plasma with high efficiency, high cleaning efficiency
§ can control the low ion energy
§ The combination of chemical reaction and physical impact
• fast processing speed, high cleaning efficiency, high reliability
• wide operation range
• can use a variety of process gas
• Automatic and easy to operate
• equipment stability, easy maintenance
• may depend on customer demand changes
Application: applicable to the PCB industry, semiconductor IC, silica gel, plastics, polymers, automotive industry, aviation industry.
1, the PCB industry: high-frequency board surface activation, multilayer board surface cleaning, desmear, soft board, rigid Flex PCB surface cleaning, desmear, soft board reinforcing activation before.
2, IC: COB, COG semiconductor, COF, ACF process, a line marking, cleaning before welding
3, silica gel, silica gel, polymer field: plastic, plastic, polymer surface roughening, etching, activation
The specification: 1820mm (W) × 1100mm (D) × 1860mm (H)
The electrode size: 12 layers of flat type electrode plate (8500mm × 550mm)
Power supply system: 10KW plasma source (40KHz, 13.56MHz)
Control system: PC control system of +PLC automatic control
Intake system: 2 - 5 working gas optional: Ar2, N2, H2, CF4, O2
Applicable to the PCB industry, semiconductor IC, silica gel, plastics, polymers, automotive industry, aviation industry:
1, the PCB industry: high-frequency board surface activation, multilayer board surface cleaning, desmear, soft board, rigid Flex PCB surface cleaning, desmear, soft board reinforcement pre activation;
2, the semiconductor IC area: COB, COG, COF, ACF technology, used for wire, welding before cleaning;
3, silica gel, silica gel, polymer field: plastic, plastic, polymer surface roughening, etching, activation.
