Ultrasonic cleaning in the main application of electronic industry in the semiconductor, crystal, resistor, capacitor, PCB board, IC chip, connector, connector, adaptor, silicon wafer, triode, diode, electronic circuit board, the computer motherboard, piezoelectric ceramic substrate, kinescope, electric vacuum devices and other electronic components production and processing process the. Electronic products according to the devices of different materials, using organic solvent, aqueous solvent, water, pure water, the cleaning quality. Of course, electronic components of different materials, different cleaning medium, the cleaning medium, and technology, process is also different, the general plastic material using city water, water, pure water as cleaning media, and different requirements of customer the process, many with electronic infrared drying line. And can be equipped with unique throwing, rotating the cleaning process so that the work piece surface cleaner. Metal material is more using organic solvent as cleaning media, with solvent filtration and recovery device, in order to improve the efficiency and reduce the cost.
Product features
■ multi arm type transmission mode, high cleaning efficiency.
■ process by PLC and touch screen interface.
■ oil water separation and filtration system
■ throwing and centrifugal dewatering device
■ vacuum drying system, fast drying work piece
■ closed cover and exhaust system, ensure good working environment
| Dimensions | L2150 x W220 x H180（cm） |
| The cleaning temperature | 60-85（℃） |
| The device type | the electronics industry |
| Work methods | ultrasonic automatic |
| Ultrasonic cleaning frequency | 28/40KHZ |
Mainly used in semiconductor, crystal, resistor, capacitor, PCB board, IC chip, connector, connector, adaptor, silicon wafer, triode, diode, electronic circuit board, the computer motherboard, piezoelectric ceramic substrate, kinescope, electric vacuum devices and other electronic components production and processing between the cleaning process.
